ATSAM3S Просмотр технического описания (PDF) - Atmel Corporation

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ATSAM3S

AT91SAM ARM-based Flash MCU

Atmel Corporation 

4. Package and Pinout

4.1 SAM3S4/2/1C Package and Pinout

Figure 4-2 shows the orientation of the 100-ball TFBGA Package

4.1.1 100-lead LQFP Package Outline

Figure 4-1. Orientation of the 100-lead LQFP Package

75

76

51

50

100

1

26

25

4.1.2 100-ball TFBGA Package Outline

The 100-Ball TFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its dimensions are 9 x 9 x 1.1 mm.

Figure 4-2. Orientation of the 100-BALL TFBGA Package

TOP VIEW

10

9

8

7

6

5

4

3

2

1

ABCDE FGH J K

BALL A1

SAM3S [SUMMARY] 11

6500ES–ATARM–11-Feb-13

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