MT6260 Просмотр технического описания (PDF) - MediaTek Inc
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производитель
MT6260 Datasheet PDF : 56 Pages
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2.3.2 Thermal Operating Specifications
Symbol
Description
Thermal resistance from device junction to package
case
Maximum package temperature
Maximum power dissipation
Value
48
65
1.28
Unit
C/W
Deg C
W
Notes
2.3.3 Lead-free Packaging
MT6260 is provided in a lead-free package and meets RoHS requirements
2.4
2.4.1
Ordering Information
Top Marking Definition
Figure 6. Mass production top marking of MT6260
Part number
MT6260A/BMB-PCU-H
Package
TFBGA
Description
8.6mm*9.6mm, 199-ball, 0.5 mm pitch package,
non-security version
Free Datasheet http://www.datasheet4u.com/
loginid=songconglin@hongyucom.com,time=2013-01-07 14:30:28,ip=61.235.102.147,doctitle=MT6260 GSM GPRS EDGE-RX SOC Processor Technical Brief v0.10 (draft).pdf,company=Hongyu_WCX
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