AD7892BR-1 Просмотр технического описания (PDF) - Analog Devices
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AD7892BR-1 Datasheet PDF : 14 Pages
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AD7892
Parameter
A Versions1 B Versions S Version2 Unit
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
DB11–DB0
Floating-State Leakage Current
Floating-State Capacitance4
Output Coding
AD7892-1 and AD7892-3
AD7892-2
4.0
4.0
4.0
0.4
0.4
0.4
± 10
± 10
± 10
15
15
15
Two’s Complement
Straight (Natural) Binary
V min
V max
µA max
pF max
ISOURCE = 200 µA
ISINK = 1.6 mA
CONVERSION RATE
Conversion Time
1.47
Track/Hold Acquisition Time3
0.2
Conversion Time
1.6
Track/Hold Acquisition Time3
0.4
1.47
0.2
1.6
1.68
0.4
0.32
µs max
µs max
µs max
µs max
AD7892-3
AD7892-3
AD7892-1 and AD7892-2
AD7892-1 and AD7892-2
POWER REQUIREMENTS
VDD
IDD5
Normal Operation
Standby Mode6
AD7892-2
AD7892-3, AD7892-1
Power Dissipation5
Normal Operation
Standby Mode6
AD7892-2
AD7892-3, AD7892-1
+5
+5
+5
18
18
19
250
250
80
80
100
90
90
95
1.25
1.25
400
400
500
V nom
mA max
µA typ
µA max
mW max
mW typ
µW max
± 5% for Specified Performance
typ 15 µA
VDD = +5 V. Typically 60 mW
VDD = +5 V. Typically 75 µW
NOTES
1Temperature ranges are as follows: A, B Versions: –40°C to +85°C; S Version: –55°C to +125°C.
2S Version available on AD7892-1 and AD7892-2 only.
3See Terminology.
4Sample tested @ +25°C to ensure compliance.
5These normal mode and standby mode currents are achieved with resistors (in the range 10 kΩ to 100 kΩ) to either DGND or VDD on Pins 8, 9, 16 and 17.
6A conversion should not be initiated on the part within 30 µs of exiting standby mode.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to AGND
AD7892-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 17 V
AD7892-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD
AD7892-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 7 V
Reference Input Voltage to AGND . . . –0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +300°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
REV. C
–3–
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