SSC-SFT722N-S Просмотр технического описания (PDF) - SEOUL SEMICONDUCTOR

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Компоненты Описание

производитель

SSC-SFT722N-S

Top View LED

SEOUL SEMICONDUCTOR 

7. Soldering Profile

(1) Reflow Soldering Conditions / Profile

Lead Solder

Pre-heat

130~210℃

Pre-heat time

120 sec. Max.

Peak-Temperature

240℃ Max.

Soldering time Condition 10 sec. Max.

. * Condition

1~5 oC / sec.

Lead Solder

1~5 oC / sec.

240 oC Max.

10 sec. Max.

Pre-heating

130~210 oC

60sec. Max.

Above 210oC

cooling

6oC/sec. Max.

120sec. Max.

(2) Lead-free solder

Lead Free Solder

Pre-heat

180~200℃

Pre-heat time

120 sec. Max.

Peak-Temperature

260℃ Max.

Soldering time Condition 10 sec. Max.

* Condition

1~5 oC / sec.

Lead-frame Solder

1~5 oC / sec.

260 oC Max.

10 sec. Max.

Pre-heating

180~220 oC

60sec. Max.

Above 220oC

cooling

6oC/sec. Max.

120sec. Max.

(1) Hand Soldering conditions

Do not exceed 4 seconds at maximum 315ºC under soldering iron.

(2) The encapsulated material of the LEDs is silicone.

Precautions should be taken to avoid the strong pressure on the encapsulated part.

So when using the chip mounter, the picking up nozzle that does not affect the

silicone resign should be used.

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

SSC-QP-7-03-08(REV.03)

SEOUL SEMICONDUCTOR CO., LTD.

148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea

Phone : 82-2-2106-7305~6

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SSC-SFT722N-S

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