TMP01EP Просмотр технического описания (PDF) - Analog Devices

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Компоненты Описание

производитель

TMP01EP

Low Power, Programmable Temperature Controller

Analog Devices 

TMP01

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

8-Pin Epoxy DIP

0.210

(5.33)

MAX

0.160 (4.06)

0.115 (2.93)

8

5

1

4

0.430 (10.92)

0.348 (8.84)

0.280 (7.11)

0.240 (6.10)

0.070 (1.77)

0.045 (1.15)

0.015

(0.381) TYP

0.130

(3.30)

MIN

0.325 (8.25)

0.300 (7.62)

0.015 (0.381)

0.008 (0.204)

0.022 (0.558)

0.014 (0.356)

0.100

(2.54)

BSC

SEATING

0°- 15°

PLANE

0.195 (4.95)

0.115 (2.93)

8-Pin SOIC

8

0.2440 (6.20)

0.2284 (5.80)

1

5

0.1574 (4.00)

0.1497 (3.80)

4

0.0098 (0.25)

0.0040 (0.10)

0.1968 (5.00)

0.1890 (4.80)

0.102 (2.59)

0.094 (2.39)

0.0196 (0.50) × 45°

0.0099 (0.25)

0.0500 (1.27) BSC 0.0192 (0.49) SEATING

0.0138 (0.35) PLANE

0.0098 (0.25)

0.0075 (0.19)

0.0500 (1.27)

0.0160 (0.41)

0°-8°

8-Pin TO-99

0.185 (4.70)

0.165 (4.19)

0.050

(1.27)

MAX

REFERENCE PLANE

0.750 (19.05)

0.500 (12.70)

0.250 (6.35)

MIN

0.115

(2.92)

BSC

5

0.160 (4.06)

0.110 (2.79)

0.335 (8.51)

0.305 (7.75)

0.370 (9.40)

0.335 (8.51)

4

0.230

(5.84)

3

BSC

2

6

0.045 (1.14)

7 0.027 (0.69)

8

0.040 (1.02) MAX

0.045 (1.14)

0.010 (0.25)

0.019 (0.48)

0.016 (0.41)

0.115

(2.92)

BSC

0.021 (0.53)

0.016 (0.41)

BASE & SEATING PLANE

1

0.034 (0.86)

0.027 (0.69)

45 °

BSC

–16–

REV. C

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