SHF-0589 Просмотр технического описания (PDF) - Unspecified
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SHF-0589 Datasheet PDF : 4 Pages
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Pin #
1
2
3
4
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
Pin Description
Function
Gate
Source
Drain
Source
Description
RF Input
Connection to ground. Use via holes to reduce lead
inductance. Place vias as close to ground leads as possible.
RF Output
Same as Pin 2
Mounting and Thermal Considerations
It is very important that adequate heat sinking be
provided to minimize the device junction
temperature. The following items should be
implemented to maximize MTTF and RF
performance.
1. Multiple solder-filled vias are required directly
below the ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with
multiple plated-through vias around pin 4 of the
device. [CRITICAL]
3. Use two point board seating to lower the thermal
resistance between the PCB and mounting plate.
Place machine screws as close to the ground tab
(pin 4) as possible. [CRITICAL]
4. Use 2 ounce copper to improve the PCB’s heat
spreading capability. [CRITICAL]
5. Thermal transfer paste should be used between
the PCB and the mounting plate to improve heat
spreading capability. [RECOMMENDED]
SHF-0589 2 Watt HFET
Part Number Ordering Information
Part Number
SHF-0589
Reel Size
7"
Devices/Reel
1000
Part Symbolization
The part will be symbolized with the “H5”
designator and a dot signifying pin 1 on the top
surface of the package.
Package Dimensions
.161
.177 .068
.016
.019 .118
.096
.041
.059
.015
DIMENSIONS ARE IN INCHES
Recommended Mounting Configuration for
Optimum RF and Thermal Performance
Plated Thru
Holes
(0.020" DIA)
Ground Plane
SHF-0x89
Machine
Screws
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
4
http://www.sirenza.com
EDS-101242 Rev F
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