NDF08N60Z, NDP08N60Z
100
VGS v 30 V
SINGLE PULSE
10 TC = 25°C
1
1 ms 100 ms 10 ms
10 ms
dc
0.1
0.01
0.1
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
1
10
100
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 12. Maximum Rated Forward Biased
Safe Operating Area NDF08N60Z
1000
10
DUTY CYCLE = 0.5
1
0.2
0.1
0.05
0.1
0.02
0.01
0.01
1E−06
SINGLE PULSE
1E−05
1E−04
1E−03
1E−02
1E−01
1E+00
1E+01
PULSE TIME (s)
Figure 13. Thermal Impedance (Junction−to−Case) for NDF08N60Z
RqJC = 3.6°C/W
Steady State
1E+02 1E+03
LEADS
HEATSINK
0.110″ MIN
Figure 14. Isolation Test Diagram
Measurement made between leads and heatsink with all leads shorted together.
*For additional mounting information, please download the ON Semiconductor
Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
Order Number
NDF08N60ZG
NDP08N60ZG
Package
TO−220FP
(Pb−Free)
TO−220AB
(Pb−Free)
Shipping
50 Units / Rail
50 Units / Rail
(In Development)
http://onsemi.com
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