L7400 Просмотр технического описания (PDF) - Intel
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L7400 Datasheet PDF : 91 Pages
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Thermal Specifications and Design Considerations
5 Thermal Specifications and
Design Considerations
The processor requires a thermal solution to maintain temperatures within operating
limits as set forth in Section 5.1. Any attempt to operate the processor outside these
operating limits may result in permanent damage to the processor and potentially other
components in the system. As processor technology changes, thermal management
becomes increasingly crucial when building computer systems. Maintaining the proper
thermal environment is key to reliable, long-term system operation. A complete
thermal solution includes both component and system level thermal management
features. Component level thermal solutions include active or passive heatsinks or heat
exchangers attached to the exposed processor die. The solution should make firm
contact to the die while maintaining processor mechanical specifications such as
pressure. A typical system level thermal solution may consist of a processor fan ducted
to a heat exchanger that is thermally-coupled to the processor via a heat pipe or direct
die attachment. A secondary fan or air from the processor fan may also be used to cool
other platform components or to lower the internal ambient temperature within the
system.
To allow for the optimal operation and long-term reliability of Intel processor-based
systems, the system/processor thermal solution should be designed such that the
processor remains within the minimum and maximum junction temperature (Tj)
specifications at the corresponding thermal design power (TDP) value listed in Table 17.
Thermal solutions not designed to provide this level of thermal capability may affect the
long-term reliability of the processor and system.
The maximum junction temperature is defined by an activation of the processor Intel
Thermal Monitor. Refer to Section 5.1.3 for more details. Analysis indicates that real
applications are unlikely to cause the processor to consume the theoretical maximum
power dissipation for sustained time periods. Intel recommends that complete thermal
solution designs target the TDP indicated in Table 17. The Intel Thermal Monitor feature
is designed to help protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained period of time. For more details on
the usage of this feature, refer to Section 5.1.3. In all cases, the Intel Thermal Monitor
feature must be enabled for the processor to remain within specification.
Datasheet
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