HLMP-1301-FG0FG Просмотр технического описания (PDF) - Avago Technologies

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HLMP-1301-FG0FG

T-1 (3 mm) Diffused LED Lamps

Avago Technologies 

Precautions

Lead Forming

• The leads of an LED lamp may be preformed or cut to

length before they are inserted and soldered into the

PC board.

• If forming a lead is required before it is soldered, then

take care to avoid any excessive mechanical stress

induced to the LED package. Otherwise, cut the LED

leads to length after soldering at room temperature.

The solder joint formed will absorb the mechanical

stress of the lead cutting from traveling to the LED chip

die attach and wirebond.

• It is recommended that tooling be made precisely and

the leads cut to length, rather than relying on your

hand.

Soldering Conditions

• Care must be taken during PCB assembly and soldering

process to prevent damage to LED component.

• The closest an LED is allowed to be soldered on board is

1.59 mm below the body (encapsulant epoxy) for those

parts without standoff.

• Recommended soldering conditions:

Wave Soldering Manual Solder Dipping

Pre-heat Temperature 105 °C Max. –

Pre-heat Time

30 sec Max. –

Peak Temperature 250 °C Max. 260 °C Max.

Dwell Time

3 sec Max. 5 sec Max.

• The wave soldering parameter must be set and

maintained according to the recommended

temperature and dwell time in the solder wave.

Customer is advised to periodically check the soldering

profile to ensure the soldering profile used always

conforms to recommended soldering condition.

• If necessary, use a fixture during soldering process to

hold the LED component in the proper orientation

with respect to the PCB.

• Proper handling is a must to avoid excessive thermal

stresses to LED components when heated. Therefore,

the soldered PCB must be allowed to cool to room

temperature, 25 °C, before handling.

• To ensure solderability, pay special attention to board

fabrication, solder masking, surface plating and lead

hole size and component orientation.

• Here are the recommended PC board plated through-

hole sizes for LED component leads:

LED Component

Lead Size

Diagonal

Plated Through-

Hole Diameter

Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm

(0.018 × 0.018 in.) (0.025 in) (0.039 to 0.043 in)

Dambar shear- 0.65 mm

off area (max.) (0.026 in)

0.919 mm

(0.036 in)

Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm

(0.020 × 0.020 in.) (0.028 in) (0.041 to 0.045 in)

Dambar shear- 0.70 mm

off area (max.) (0.028 in)

0.99 mm

(0.039 in)

Note: Refer to application note AN1027 for more information on

soldering LED components.

TURBULENT WAVE

LAMINAR WAVE

250

HOT AIR KNIFE

200

150

FLUXING

100

50

30

PREHEAT

0 10 20 30 40 50 60 70 80 90 100

TIME – SECONDS

BOTTOM SIDE

OF PC BOARD

TOP SIDE OF

PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150C (100C PCB)

SOLDER WAVE TEMPERATURE = 245C

AIR KNIFE AIR TEMPERATURE = 390C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40

SOLDER: SN63; FLUX: RMA

NOTE: ALLOW FOR BOARDS TO BE

SUFFICIENTLY COOLED BEFORE EXERTING

MECHANICAL FORCE.

Figure 17. Recommended wave soldering profile

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4252EN

AV02-1555EN - August 22, 2013

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