EUA6011A Просмотр технического описания (PDF) - Eutech Microelectronics Inc
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производитель
EUA6011A Datasheet PDF : 20 Pages
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Package Information
EUA6011A
Use as much
copper area
as possible
Bottom view
Exposed Pad
NOTE
1. Package body sizes exclude mold flash protrusion or gate burrs
2. Tolerance ± 0.1mm unless otherwise specified
3. Coplanarity :0.1mm
4. Controlling dimension is millimeter.
5. Die pad exposure size is according to lead frame design.
6. Standard Solder Map dimension is millimeter.
7. Followed from JEDEC MO-15
SYMBOLS
A
A1
A2
b
C
D
E
E1
e
L
y
θ
DIMENSIONS IN MILLIMETERS
MIN.
NOM.
MAX.
------
------
1.15
0.00
------
0.10
0.80
1.00
1.05
0.19
------
0.30
0.09
------
0.20
7.70
7.80
7.90
------
6.40
-----
4.30
4.40
4.50
------
0.65
-----
0.45
0.60
0.75
------
------
0.10
0
------
8
DIMENSIONS IN INCHES
MIN.
NOM.
MAX.
------
------
0.045
0.000
------
0.004
0.031
0.039
0.041
0.007
------
0.012
0.004
------
0.008
0.303
0.307
0.311
------
0.252
------
0.169
0.173
0.177
------
0.026
------
0.018
0.024
0.030
------
------
0.004
0
------
8
DS6011A Ver 1.0 Mar. 2006
20
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