CS5211
5.0 V
+
100 mF/10 V × 3
0.1 mF
0.1 mF
10
VC
VCC
COMP
ROSC
BST
GATE(H)
GATE(L)
PGND
51 k
CS5211 IS+
IS−
SGND
VFFB
LGND
VFB
0.1 mF
1.0 k
1.0%
2.9 mH
4.7 k
0.1 mF
1.0%
1.5 k
0.1 mF
4.7 k
2.5 V/8.0 A
+VOUT
+
100 mF/10 V × 2
10
−VOUT
Return
SENSE+
680 pF
Figure 1. Application Diagram, 5.0 V to 2.5 V/8.0 A Converter with Differential Remote Sense
SENSE−
ORDERING INFORMATION
Device
Operating Temperature Range
Package
Shipping†
CS5211ED14
SOIC−14
55 Units / Rail
CS5211ED14G
CS5211EDR14
−40°C < TA < 85°C
SOIC−14
(Pb−Free)
SO−14
55 Units / Rail
2500 / Tape & Reel
CS5211EDR14G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
CS5211GD14
SO−14
55 Units / Rail
CS5211GD14G
CS5211GDR14
0°C < TA < 70°C
SOIC−14
(Pb−Free)
SO−14
55 Units / Rail
2500 / Tape & Reel
CS5211GDR14G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Value
Unit
Operating Junction Temperature, TJ
Lead Temperature Soldering: Reflow: (SMD styles only) (Note 1)
150
°C
230 peak
°C
Storage Temperature Range, TS
Package Thermal Resistance, Junction−to−Case, RqJC
Junction−to−Ambient, RqJA
ESD Susceptibility (Human Body Model)
−65 to +150
30
125
2.0
°C
°C/W
°C/W
kV
JEDEC Moisture Sensitivity
1.0
−
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. 60 second maximum above 183°C.
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