
BYG20D - BYG20J
Taiwan Semiconductor
175
150
125
100
75
50
25
0
0.1
FIG. 5 TYPICAL JUNCTION CAPACITANCE
1
10
100
REVERSE VOLTAGE (V)
1000
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min Max
1.27 1.58
4.06 4.60
2.29 2.83
1.99 2.50
0.90 1.41
4.95 5.33
0.10 0.20
0.15 0.31
Unit (inch)
Min Max
0.050 0.062
0.160 0.181
0.090 0.111
0.078 0.098
0.035 0.056
0.195 0.210
0.004 0.008
0.006 0.012
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
MARKING DIAGRAM
P/N =
G=
YW =
F=
Specific Device Code
Green Compound
Date Code
Factory Code
Unit (mm)
1.68
1.52
3.93
2.41
5.45
Unit (inch)
0.066
0.060
0.155
0.095
0.215
Document Number: DS_D0000075
Version: C15