BAT54J,115 Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

производитель

BAT54J,115

Schottky barrier single diode

NXP Semiconductors. 

NXP Semiconductors

8. Package outline

BAT54J

Schottky barrier single diode

1.35

1.15

1

2.7 1.8

2.3 1.6

0.80

0.65

0.5

0.3

Dimensions in mm

2

0.40

0.25

Fig 4. Package outline SOD323F (SC-90)

0.25

0.10

04-09-13

9. Packing information

Table 8. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number Package

Description

Packing quantity

3 000

10 000

BAT54J

SOD323F 4 mm pitch, 8 mm tape and reel

-115

-135

[1] For further information and the availability of packing methods, see Section 13.

10. Soldering

1.65 0.95

3.05

2.80

2.10

1.60

0.50 0.60

0.50

(2×)

001aab169

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 5. Reflow soldering footprint SOD323F (SC-90)

solder lands

solder resist

occupied area

solder paste

BAT54J_1

Product data sheet

Rev. 01 — 8 March 2007

© NXP B.V. 2007. All rights reserved.

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