ADG801BRT Просмотр технического описания (PDF) - Analog Devices

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Компоненты Описание

производитель

ADG801BRT

<0.5 Ω CMOS, Low Voltage, SPST Switches

Analog Devices 

PRELIMINARY TECHNICAL DATA

ADG801/ADG802

ABSOLUTE MAXIMUM RATINGS1

(TA = +25°C unless otherwise noted)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Inputs2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.3 V to VDD +0.3 V

. . . . . . . . . . . . . . . . . . . . or 30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 400 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 800 mA

(Pulsed at 1 ms, 10% Duty Cycle Max)

Operating Temperature Range

Extended . . . . . . . . . . . . . . . . . . . . . . . –40°C to +125°C

Storage Temperature Range . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C

µSOIC Package, Power Dissipation . . . . . . . . . . . 315 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 206°C/W

θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . 44°C/W

SOT-23 Package, Power Dissipation . . . . . . . . . . 282 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . 229.6°C/W

θJC Thermal Impedance . . . . . . . . . . . . . . . . . 91.99°C/W

Lead Temperature, Soldering (10seconds) . . . . . . . 300°C

IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . +220°C

ESD.....................................................................2kV

NOTES

1Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions above

those listed in the operational sections of this specification is not implied.

Exposure to absolute maximum rating conditions for extended periods

may affect device reliability. Only one absolute maximum rating may

be applied at any one time.

2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be

limited to the maximum ratings given.

Table I. Truth Table

ADG801 In

0

1

ADG802 In

1

0

Switch Condition

OFF

ON

PIN CONFIGURATIONS

6-Lead Plastic Surface Mount (SOT-23)

(RT-6)

D1

6 VDD

ADG801/

S 2 ADG802 5 NC

GND 3 TOP VIEW 4 IN

(Not to Scale)

NC = NO CONNECT

8-Lead Small Outline µSOIC

(RM-8)

D1

NC 2

NC 3

VDD 4

8

ADG801/ 7

ADG802

TOP VIEW 6

(Not to Scale)

5

S

GND

IN

NC

NC = NO CONNECT

ORDERING GUIDE

Model

Temperature Range Supply Option1 Brand1 Package Descriptions

Package Options

ADG801BRT

ADG801BRM

ADG802BRT

ADG802BRM

–40°C to +125°C

–40°C to +125°C

–40°C to +125°C

–40°C to +125°C

3 V, 5 V

3 V, 5 V

3 V, 5 V

3 V, 5 V

SLB

SLB

SMB

SMB

SOT-23 (Plastic Surface Mount) RT-6

µSOIC (Small Outline)

RM-8

SOT-23 (Plastic Surface Mount) RT-6

µSOIC (Small Outline)

RM-8

1Branding on SOT-23 and µSOIC packages is limited to 3 characters due to space constraints.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADG801/ADG802 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

–4–

WARNING!

ESD SENSITIVE DEVICE

REV. PrE

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