TS4984FC Просмотр технического описания (PDF) - STMicroelectronics

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TS4984FC

1.2W Stereo Audio Power Amplifier with Active Low Standby Mode

STMicroelectronics 

TS4984FC

Package Mechanical Data

Figure 74. Package mechanical data for 15-bump flip-chip

1.90 mm

2.40 mm

0.86mm

0.25m

m

0.5mm

∅ 0.3mm

60 µm Back coating *

600 µm

■ Die size: 2.40 x 1.90 mm ±30µm

■ Die height (including bumps): 600µm

■ Back Coating height (optional):

60µm±10µm

■ Bump Diameter: 315µm ±50µm

■ Bump Diameter Before Reflow:

300µm ±10µm

■ Bump Height: 250µm ±40µm

■ Die Height: 350µm ±20µm

■ Pitch: 500µm ±50µm

■ Coplanarity: 60µm max.

* Optional

Figure 75. Tape & Reel specification (top view)

4

1.5

1

A

8

1

A

Die size X + 70µm

4

All dimensions are in mm

User direction of feed

29/30

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