ST7713 Просмотр технического описания (PDF) - Sitronix Technology Co., Ltd.
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ST7713 Datasheet PDF : 159 Pages
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ST7713
3. Pad arrangement
PADA3
PADB3
DUMMY
DUMMY
DUMMY
G132
G128
G130
G4
DUMMY
DUMMY
DUMMY
S396
S394
G2
DUMMY
DUMMY
DUMMY
S395
S3
S1
DUMMY
DUMMY
DUMMY
G3
S2
DUMMY
DUMMY
DUMMY
G1
G5
G127
G131
TEST
DUMMY
PADA4
PADB4
G129
TEST
TEST
DUMMY
DUMMY
PADB2
PADA2
VCOM
VCOM
VCOM
PADB0
VCOML
VCOML
VCOML
VCOMH
VCOMH
VCOMH
VGH
VGH_I
VGH_I
VGL
VGL_I
VGL_I
C23N
C23N
C23P
C23P
C22N
C22N
C22P
C22P
C21N
C21N
C21P
C21P
VCL
VCL_I
VCL_I
AGND
AGND
AGND
C12N
C12N
C12N
C12P
C12P
C12P
C11N
C11N
C11N
C11P
C11P
C11P
GVDD
GVDD
GVDD
AVDD
AVDD
AVDD_I
AVDD_I
AVDD_I
TPI[2]
TPI[1]
VREF
VREF
VREF
VDD
VDD
VDD
VDD
VDD
AGND
AGND
AGND
AGND
AGND
AGND
VCI1
VCI1
VCI1
VCC
VCC
VCC
VDDI
VDDI
VDDI
VDDI
VDDI
VDDI
DGND
DGND
DGND
DGND
DGND
DGND
DGND
TPO[1]
TPO[2]
TPO[3]
VS
HS
DE
DGND
PCLK
DGND
D/CX (SCL)
DGND
RESX
SPI-4
GS
SDA
WRX (R/Wx)
RDX (E)
CSX
TE
OSC
TPO[4]
TPO[5]
TPO[6]
TPO[7]
TPO[8]
D0 (SDA)
D1
D2
D3
D4
D5
D6
D7
TESEL
DGNDO
D8
D9
D10
D11
D12
D13
D14
D15
D16
D17
DGNDO
LCM1
VDDIO
LCM0
TPI[3]
TPI[4]
DGNDO
SHUT
VDDIO
TB
DGNDO
RL
VDDIO
REV
DGNDO
IDM
VDDIO
SMY
DGNDO
SMX
VDDIO
SRGB
DGNDO
RCM1
VDDIO
RCM0
DGNDO
P68
VDDIO
IM2
DGNDO
IM1
VDDIO
IM0
DGNDO
EXTC
PADA0
PADB1
PADA1
View point: bump view
Chip size (um): 13480 x 690
PAD coordinate: pad center
Coordinate origin: chip center
Chip thickness (um): 300±15
Bump height (um): 15±3
Bump hardness (HV): 75±25
Pad arrangement (Unit: um):
Output: pad No. 1 ~ 585 = 21 x 96
21 23
96
22
35
96
Input: pad No. 586 ~ 760 = 55 x 96
Alignment mark (unit: um):
(-6627.5, -195.5)
(6627.5, -195.5)
Ver 1.6
3
2008-05
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