Detector Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA(K)or CC(T)at soldering portion(copper foil surface). A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
300
200
100
Room
temperature
Pre-heating
F max.
A max.
B
D
E
Time (s)
C
Detector
Push
Slide
Rotary
Encoders
Power
Dual-in-line
Package Type
TACT SwitchTM
Custom-
Products
Series(Reflow type)
SPPB
SPPW8
A(℃)
3s max.
250
B(℃)
230
200
C(s)
40
20
D(℃)
E(℃)
F(s)
SPVE
SPVG
SPVL
SPVM
180
150
120
SPVN
SPVP
260
40
230
SPVR
SPVS
SSCM
SPPY5
240
20
150
Room
temperature
180
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
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