Philips Semiconductors
Power amplifier controller for GSM and
PCN systems
PACKAGE OUTLINE
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
Product specification
PCF5078
SOT505-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
1
e
4
bp
wM
A2 A1
(A3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.10
2.90
3.10
2.90
0.65
5.10
4.70
0.94
0.70
0.40
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT505-1
v
w
y
Z(1)
θ
0.1
0.1
0.1
0.70
0.35
6°
0°
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
1999 Apr 12
14