NCP362 Просмотр технического описания (PDF) - ON Semiconductor
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NCP362 Datasheet PDF : 17 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN10 2.5x2, 0.5P
CASE 517AV−01
ISSUE A
SCALE 4:1
D
AB
L
L
PIN ONE
ÍÍÍ REFERENCE
ÍÍÍÍÍÍ 2X
0.15 C
2X
0.15 C TOP VIEW
DETAIL B
A3
0.10 C
0.08 C
NOTE 4
A1
SIDE VIEW
L1
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
EXPOSED Cu
MOLD CMPD
A
ÇÉÉÇÉÉÇÉÉ A3
A1
DETAIL B
OPTIONAL
CONSTRUCTION
C
SEATING
PLANE
DATE 12 FEB 2009
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3
0.13 REF
b 0.20 0.30
D
2.50 BSC
D2 1.35 1.55
D3 0.30 0.50
E
2.00 BSC
E2 0.95 1.15
e
0.50 BSC
F
1.08 BSC
K 0.20 ---
L 0.20 0.30
L1 --- 0.15
0.10 C A B
D2
DETAIL A
10X L
F
1
10X b
0.10 C A B
0.05 C NOTE 3
5
GENERIC
MARKING DIAGRAM*
XXXM
G
E2
K
10
e
0.10 C A B
6
D3
F
0.10 C A B
BOTTOM VIEW
XXX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
1.55
1.13
10X
0.30
10X
0.43
1.15 2.30
DOCUMENT NUMBER: 98AON35760E
DESCRIPTION: UDFN10 2.5X2, 0.5P
PACKAGE
OUTLINE
1
0.50
0.50
PITCH
1.13
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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