MSM9000B-XXAV-Z-XX Просмотр технического описания (PDF) - Oki Electric Industry
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MSM9000B-XXAV-Z-XX Datasheet PDF : 39 Pages
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¡ Semiconductor
PAD CONFIGURATION
Pad Layout
Chip size: 4.76 ¥ 3.29 mm
Bump size: 78 ¥ 100 mm
Y
87
88
FEDL9000B-01
MSM9000B-xx
50
49
X
112
1
25
24
Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Pad Name
VSS
CS
C/D
RD
WR
SI
SHT
SO
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
VDD
TEST
N1
N2
X (µm)
–2012
–1837
–1662
–1487
–1312
–1137
–962
–787
–612
–437
–262
–88
88
262
437
612
787
962
1137
1312
Y (µm)
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
–1508
Pad No.
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Pad Name
VCC1
VC1
VSH
VSS6
VCC2
VC2
VSS1
VSS2,3
VSS4
VSS5
COM9
COM10
COM11
COM12
COM13
COM14
COM15
COM16
SEG60
SEG59
X (µm)
1487
1662
1837
2012
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
2194
Y (µm)
–1508
–1508
–1508
–1508
–1375
–1255
–1135
–1015
–895
–775
–605
–495
–385
–275
–165
–55
55
165
275
385
37/39
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