MPXHZ6400A Просмотр технического описания (PDF) - Freescale Semiconductor

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MPXHZ6400A

High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

The two sides of the pressure sensor are designated as

the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorosilicone gel,

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table:

Part Number

MPXH6400AC6U

MPXH6400AC6T1

MPXHZ6400AC6T1

MPXA6400AP

Case Type

1317A

1317A

1317A

1369

Pressure (P1) Side Identifier

Side with Port Attached

Side with Port Attached

Side with Port Attached

Side with Port Attached

SURFACE MOUNTING INFORMATION

Minimum Recommended Footprint for Small Outline Package

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 4. SOP Footprint (Case 1369)

Minimum Recommended Footprint for Super Small Outline Package

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.150

3.81

0.050

1.27

TYP

0.387

9.83

0.027 TYP 8X

0.69

0.053 TYP 8X

inch

1.35

mm

Figure 5. SSOP Footprint (Case 1317A)

MPXH6400A

6

Sensors

Freescale Semiconductor

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