TIMING DIAGRAM
VIH
CS, BYTE1/BYTE2
VIL
VIH
WR
VIL
VIH
DATA BITS
VIL
IOUT1, IOUT2
MP1230A/31A/32A
tCS
50%
t CH
50%
tWR
50%
50%
50%
tDS
tDH
50%
tS
SETTLED TO
+0.01%
DEFINITION OF CONTROL SIGNALS:
CS: Chip Select.(Active low)
It will enable WR1.
WR1:
Write 1 (Active low)
The WR1 is used to load the digital data bits (DB) into
the input latch.
BYTE1/BYTE2: Byte sequence control.
The BYTE1/BYTE2 control pin is used to select both
MSB and LSB input latches.
WR2: Write 2 (Active low)
It will enable XFER.
XFER:
Transfer control signal (Active low)
This signal in combination with WR2 causes the 16-bit
data which is available in the input latches to transfer
to the DAC register
DB0 to DB11: Digital Inputs.
DB0 is the least significant digital input (LSB) and
DB11 is the most significant digital input (MSB).
IOUT1:
DAC Current Output 1 Bus.
IOUT1 is a maximum for a digital code of all 1’s in the
DAC register, and is zero for all 0’s in the DAC register.
IOUT2:
RFB:
DAC Current Output 2 Bus.
IOUT2 is a complement of IOUT1.
Feedback Resistor.
This internal feedback resistor should always be used
(not an external resistor) since it matches the resistors
in the DAC and tracks these resistors over tempera-
ture.
VREF:
Reference Voltage Input.
This input connects an external precision voltage
source to the internal DAC. The VREF can be selected
over the range of +25V to –25V or the analog signal for
a 4-quadrant multiplying mode application.
VDD:
Power Supply Voltage.
This is the power supply pin for the part. The VDD can
be from +5 V DC to +15 V DC, however optimum volt-
age is +12 to +15 V DC.
AGND: Analog Ground
Back gate of the DAC N-channel current steering
switches.
DGND: Digital Ground
Rev. 2.00
5