MCP6031 Просмотр технического описания (PDF) - Microchip Technology
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MCP6031 Datasheet PDF : 30 Pages
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MCP6031/2/3/4
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
12
e
b
c
A
A2
φ
A1
L1
L
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
0.65 BSC
Overall Height
A
–
–
1.10
Molded Package Thickness
A2
0.75
0.85
0.95
Standoff
A1
0.00
–
0.15
Overall Width
E
4.90 BSC
Molded Package Width
E1
3.00 BSC
Overall Length
D
3.00 BSC
Foot Length
L
0.40
0.60
0.80
Footprint
L1
0.95 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.08
–
0.23
Lead Width
b
0.22
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
0.40
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
DS22041A-page 21
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