MCP1601T-IMS Просмотр технического описания (PDF) - Microchip Technology
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MCP1601T-IMS Datasheet PDF : 24 Pages
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MCP1601
TABLE 5-4: INDUCTOR SUPPLIERS
Supplier
L
Type
Area (mm)
Sumida®
Sumida®
Sumida®
10 µH
10 µH
10 µH
Unshielded
Shielded
Shielded
4.1 mm x 3.8 mm
4.0 mm x 4.0 mm
5.7 mm x 5.7 mm
CT*
Coilcraft®
Coilcraft®
Coilcraft®
Coilcraft®
Coilcraft®
10 µH
10 µH
15 µH
22 µH
10 µH
15 µH
Shielded
Shielded
Shielded
Shielded
Unshielded
Wafer
Unshielded
Wafer
7.3 mm x 7.3 mm
6.6 mm x 4.5 mm
6.6 mm x 4.5 mm
6.6 mm x 4.5 mm
6.0 mm x 5.4 mm
6.0 mm x 5.4 mm
Taiyo
Yuden™
10 µH
Shielded
5.0 mm x 5.0 mm
Note: CT* = Central Technologies
5.5 Efficiency
Efficiency will be affected by the external component
selection and the specific operating conditions for the
application. In Section 2.0, “Typical Performance
Curves”, there are curves plotted using typical induc-
tors that can be used to estimate the converter
efficiency for 1.2V, 1.8V and 3.3V.
Height
(mm)
3.0 mm
1.8 mm
3.0 mm
3.5 mm
3.0 mm
3.0 mm
3.0 mm
1.3 mm
DC
Resistance
230 M
160 M
65 M
70 M
75 M
90 M
110 M
300 M
Max.
Current
0.76A
0.66A
1.3A
1.7A
1.0A
0.8A
0.7A
0.60A
Series
C32
CDRH3D16
CDRH5D28
CTCDRH73
DS1608
DS1608
DS1608
LPO6013
1.3 mm
380 M
0.55A LPO6013
2.0 mm
66 M
0.7A NP04SB100M
5.6 Printed Circuit Board Layout
The MCP1601 is capable of switching over 500 mA at
750 kHz. As with all high-frequency, switch mode,
power supplies, a good board layout is essential to pre-
venting the noise generated by the power train switch-
ing from interfering with the sensing circuitry. The
MCP1601 has not demonstrated a sensitivity to layout,
but good design practice will prevent undesired results.
2003-2013 Microchip Technology Inc.
MCP1601
CIN
PGND
SILK
AGND
C1
R2
AGND
COUT
PGND
R1
FIGURE 5-2:
Component Placement.
When designing a board layout for the MCP1601, the
first thing to consider is the physical placement of the
external components. In Figure 5-2, SM0805 10 µF
ceramic capacitors are used for CIN and COUT. The
SM0603 package is used for R1, R2 and C1. The induc-
tor used is the Coilcraft® LPO2506 series low profile
(0.047” high). The board outline in this example is 1” x
1”. CIN, L and COUT are positioned around the
MCP1601 to make the high current paths as short as
possible.
DS21762B-page 15
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