MC100EP35DG(2016) Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание

производитель

MC100EP35DG
(Rev.:2016)

3.3V / 5V ECL JK Flip‐Flop

ON Semiconductor 

MC10EP35, MC100EP35

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

VCC PECL Mode Power Supply

VEE

NECL Mode Power Supply

VI

PECL Mode Input Voltage

NECL Mode Input Voltage

Iout

Output Current

VEE = 0 V

VCC = 0 V

VEE = 0 V

VCC = 0 V

Continuous

Surge

VI ≤ VCC

VI ≥ VEE

6

V

−6

V

6

V

−6

50

mA

100

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction-to-Ambient) 0 lfpm

500 lfpm

SOIC−8 NB

−40 to +85

−65 to +150

190

130

°C

°C

°C/W

qJC

Thermal Resistance (Junction-to-Case)

Standard Board

qJA

Thermal Resistance (Junction-to-Ambient) 0 lfpm

500 lfpm

SOIC−8 NB

TSSOP−8

41 to 44

185

140

°C/W

°C/W

qJC

Thermal Resistance (Junction-to-Case)

Standard Board

qJA

Thermal Resistance (Junction-to-Ambient) 0 lfpm

500 lfpm

TSSOP−8

DFN−8

41 to 44

129

84

°C/W

°C/W

Tsol

Wave Solder (Pb-Free)

qJC

Thermal Resistance (Junction-to-Case)

<2 to 3 sec @ 260°C

(Note 1)

DFN−8

265

35 to 40

°C

°C/W

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)

www.onsemi.com

3

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