L6227Q Просмотр технического описания (PDF) - STMicroelectronics

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производитель

L6227Q

DMOS dual full bridge driver with PWM current controller

STMicroelectronics 

L6227Q

8

Package mechanical data

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Table 9. VFQFPN32 5x5x1.0 pitch 0.50

Dim.

Databook (mm)

Min

Typ

Max

A

0.80

0.85

0.95

b

0.18

0.25

0.30

b1

0.165

0.175

0.185

D

4.85

5.00

5.15

D2

3.00

3.10

3.20

D3

1.10

1.20

1.30

E

4.85

5.00

5.15

E2

4.20

4.30

4.40

E3

0.60

0.70

0.80

e

0.50

L

0.30

0.40

0.50

ddd

0.08

Note: 1 VFQFPN stands for thermally enhanced very thin profile fine pitch quad flat package no

lead. Very thin profile: 0.80 < A = 1.00 mm.

2 Details of terminal 1 are optional but must be located on the top surface of the package by

using either a mold or marked features.

23/27

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