H28505(1998) Просмотр технического описания (PDF) - Intersil
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H28505 Datasheet PDF : 7 Pages
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Die Characteristics
DIE DIMENSIONS:
65 mils x 52 mils x 19 mils
1650µm x 1310µm x 483µm
METALLIZATION:
Type: Aluminum, 1% Copper
Thickness: 16kÅ ±2kÅ
SUBSTRATE POTENTIAL
V-
Metallization Mask Layout
-IN
+IN
HA-2850
PASSIVATION:
Type: Nitride over Silox
Silox Thickness: 12kÅ ±2kÅ
Nitride Thickness: 3.5kÅ ±1kÅ
TRANSISTOR COUNT:
34
PROCESS:
High Frequency Bipolar Dielectric Isolation
HA-2850
V+
OUT
V-
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