HT45F12(2012) Просмотр технического описания (PDF) - Holtek Semiconductor
Номер в каталоге
Компоненты Описание
производитель
HT45F12 Datasheet PDF : 104 Pages
| |||
HT45F12
8-Bit Flash MCU with Op Amps & Comparators
Pin Name
PC5/C1N
PC6/C2P
VDD
VSS
Function
PC5
C1N
PC6
C2P
VDD
VSS
OPT
PCPU
CMP1C1
PCPU
CMP2C1
—
—
I/T
ST
CMPI
ST
CMPI
PWR
PWR
O/T
CMOS
—
CMOS
—
—
—
Description
General purpose I/O. Register enabled pull-up
Comparator 1 inverting input pin
General purpose I/O. Register enabled pull-up
Comparator 2 non-inverting input pin
Power supply
Ground
Note: I/T: Input type
O/T: Output type
OPT: Optional by configuration option (CO) or register option
PWR: Power
CO: Configuration option
ST: Schmitt Trigger input
CMOS: CMOS output
NMOS: NMOS output
HXT: High frequency crystal oscillator
OPAI: Operational Amplifier input
OPAO: Operational Amplifier output
CMPI: Comparator input
CMPO: Comparator output
As the Pin Description Summary table applies to the package type with the most pins, not all of the above
listed pins may be present on package types with smaller numbers of pins.
Absolute Maximum Ratings
Supply Voltage ��������������������������������������������������������������������������������������������������������������������������VSS-0.3V to VSS +6.0V
Input Voltage ����������������������������������������������������������������������������������������������������������������������������VSS-0.3V to VDD +0.3V
IOL Total..............................................................100mA
Total Power Dissipation ������������������������������������500mV
IOH Total........................................................... -100mA
Storage Temperature ........................... -50°C to 150°C
Operating Temperature ....................... -40°C to 150°C
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings”
may cause substantial damage to the device. Functional operation of this device at other conditions beyond
those listed in the specification is not implied and prolonged exposure to extreme conditions may affect
device reliability.
Rev. 0.00
10
September 26, 2012
Share Link: 