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HLMP-ED55-HP400 Просмотр технического описания (PDF) - HP => Agilent Technologies

Номер в каталоге
Компоненты Описание
производитель
HLMP-ED55-HP400
HP
HP => Agilent Technologies 
HLMP-ED55-HP400 Datasheet PDF : 6 Pages
1 2 3 4 5 6
3
Package Dimensions
8.71 ± 0.20
(0.343 ± 0.008
31.60
(1.244)
MIN.
5.00 ± 0.20
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
0.70 (0.028)
MAX.
2.35 (0.093)
MAX.
CATHODE
LEAD
1.00 MIN.
(0.039)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
CATHODE
FLAT
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
4. RECOMMENDED PC BOARD HOLE DIAMETERS:
LAMP PACKAGE WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).

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