HI-8783, HI-8784, HI-8785
ADDITIONAL HI-8783 PIN CONFIGURATION
561 SYNC 1
22 VCC
D0 2
21 561 DATA
D1 3
20 DATA ZERO
D2 4 HI-8783PDI 19 DATA ONE
&
D3 5 HI-8783PDT 18 PARITY ENB
D4 6
17 XMT READY
D5 7
16 XMIT CLK
D6 8
15 RESET
NC 9
14 WRITE
D7 10
13 NC
GND 11
12 A0
22 Pin Plastic DIP package
(See page 1 for additional pin configurations)
ORDERING INFORMATION
PART
NUMBER
HI-8783PDI
INCLUDES
LINE DRIVER
NO
OUTPUT
RESISTOR
HI-8783PDT
NO
HI-8783PSI
NO
HI-8783PST
NO
HI-8784PSI
YES
37.5 ohm
HI-8784PST
YES
37.5 ohm
HI-8785PSI
YES
10.0 ohm
HI-8785PST
YES
10.0 ohm
Legend: WB - Wide Body
PACKAGE
DESCRIPTION
22 Pin Plastic DIP
TEMPERATURE PROCESS LEAD
RANGE
FLOW FINISH
-40°C TO +85°C
I
SOLDER
22 Pin Plastic DIP
-55°C TO +125°C
T
SOLDER
20 Pin Plastic SOIC - WB -40°C TO +85°C
I
SOLDER
20 Pin Plastic SOIC - WB -55°C TO +125°C
T
SOLDER
24 Pin Plastic SOIC - WB -40°C TO +85°C
I
SOLDER
24 Pin Plastic SOIC - WB -55°C TO +125°C
T
SOLDER
24 Pin Plastic SOIC - WB -40°C TO +85°C
I
SOLDER
24 Pin Plastic SOIC - WB -55°C TO +125°C
T
SOLDER
HOLT INTEGRATED CIRCUITS
7