HCC4001BD Просмотр технического описания (PDF) - STMicroelectronics
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HCC4001BD Datasheet PDF : 24 Pages
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HCC4xxx
Package mechanical data
Table 7. Ceramic DIL-16 package dimensions
mm
Dim
Min
Typ
A
2.10
a1
3.00
a2
0.63
0.88
B
1.82
b
0.40
0.45
b1
0.20
0.254
D
20.06
20.32
E
7.36
7.62
e
2.54
e1
17.65
17.78
e2
7.62
7.87
F
7.29
7.49
I
K
10.90
L
1.14
Figure 5. Ceramic DIL-16 package drawings
Max
2.71
3.70
1.14
2.39
0.50
0.30
20.58
7.87
17.90
8.12
7.70
3.83
12.10
1.50
Note:
The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not affect
the electrical characteristics.
Doc ID 17102 Rev 3
13/24
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