FOA1252A1
2
Electrical Characteristics
Electrical Characteristics
2.1
Absolute Maximum Ratings
Ambient temperature Tamb = -40 °C … +85 °C
Parameter
Symbol Limit Values
min. max.
Supply voltage
VCC
-0.5
6.0
Junction temperature
Tj
-40
+125
Storage temperature
TS
-40
+150
Relative ambient humidity –
–
85/85
ESD integrity
VESD 500
–
Unit Remarks
V
–
°C –
°C –
%/°C no condensation
V
see note
Note: HBM according to MIL STD 883D, method 3015.7 and ESD Assn. Standard
S5.1-1993
Note: Stresses above the ones listed here may cause permanent damage to the
device. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2.2
Recommended Operating Conditions
Ambient temperature Tamb = -40 °C … +85 °C
Parameter
Symbol Limit Values
Unit Remarks
min. typ. max.
Supply voltage
Data transmission rate
VCC
+4.5 +5.0 +5.5 V
–
–
– 2.5 – Gbit/s –
Supply current
Thermal resistance
Junction temperature
ICC
– 46.7 – mA –
ΘJA
–
140 –
K/W 1)
Tj
-10 – +125 °C –
1) Junction-to-ambient thermal resistance measurement conditions for packaged device:
PCB area: 10 cm × 10 cm × 1.5 mm; copper area approx. 60%; via holes to ground layer underneath the
device; all pins soldered.
Preliminary Data Sheet
4
1998-07