Typical Performance Curves (Continued)
EL2126
-9.4
-9.6
-9.8
VS=±15V
-10
-10.2
-10.4
-10.6
-50
0
50
100
150
Die Temperature (°C)
FIGURE 47. NEGATIVE LOADED OUTPUT SWING vs TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
1
781mW
0.8
0.6
θJA
488mW
=
SO8
+160°C/W
0.4
0.2
θJA
=
SOT23-5
+256°C/W
0
0
25
50
75 85 100 125 150
AMBIENT Temperature (°C)
FIGURE 48. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.8
1.6
1.4
1.2 1.136W
1
0.8
0.6
0.4
0.2
543mW
θJA
=
SO8
+110°C/W
θJA
SOT23-5
= +230°C/W
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 49. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
13
FN7046.4
May 2, 2007