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DTC123TM3 Просмотр технического описания (PDF) - ON Semiconductor

Номер в каталоге
Компоненты Описание
производитель
DTC123TM3 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
MUN2238, MMUN2238L, MUN5238, DTC123TE, DTC123TM3, NSBC123TF3
PACKAGE DIMENSIONS
b 3 PL
0.20 (0.008) M D
E
2
3
1
C
L
SC75/SOT416
CASE 463
ISSUE F
e D
HE
0.20 (0.008) E
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS
DIM MIN NOM MAX
A 0.70 0.80 0.90
A1 0.00 0.05 0.10
b 0.15 0.20 0.30
C 0.10 0.15 0.25
D 1.55 1.60 1.65
E 0.70 0.80 0.90
e
1.00 BSC
L 0.10 0.15 0.20
HE 1.50 1.60 1.70
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
INCHES
MIN NOM MAX
0.027 0.031 0.035
0.000 0.002 0.004
0.006 0.008 0.012
0.004 0.006 0.010
0.059 0.063 0.067
0.027 0.031 0.035
0.04 BSC
0.004 0.006 0.008
0.061 0.063 0.065
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
ǒ mm Ǔ
inches
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10

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