CXG1017N Просмотр технического описания (PDF) - Sony Semiconductor

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Компоненты Описание

производитель

CXG1017N

GSM1800/1900 DPDT TX/RX Antenna Switch

Sony Semiconductor 

<For Europe and America>

Package Outline

Unit: mm

∗3.0 ± 0.1

8PIN SSOP (PLASTIC)

85

A

+ 0.2

1.25 – 0.1

0.1

1

+ 0.08

0.24 – 0.07

B

4

0.65

0.13 M

0.25

0.1 ± 0.05

CXG1017N

+ 0.08

0.24 – 0.07

(0.22)

0° to 10°

DETAIL A

DETAIL B

NOTE: Dimension “∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-8P-L01

SSOP008-P-0044

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER / PALLADIUM

PLATING

COPPER ALLOY

PACKAGE MASS

0.04g

–7–

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