BLF573 Просмотр технического описания (PDF) - NXP Semiconductors.
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BLF573 Datasheet PDF : 16 Pages
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NXP Semiconductors
BLF573; BLF573S
HF / VHF power LDMOS transistor
Table 9. List of components …continued
For production test circuit, see Figure 9 and Figure 10.
Printed-Circuit Board (PCB): Rogers 5880; εr = 2.2 F/m; height = 0.79 mm; Cu (top/bottom metallization);
thickness copper plating = 35 μm.
Component Description
Value
Remarks
C15
multilayer ceramic chip capacitor 33 pF
[1]
C16
multilayer ceramic chip capacitor 36 pF
[1]
C17
multilayer ceramic chip capacitor 16 pF
[1]
C19
electrolytic capacitor
220 μF; 63 V
L1
2 turns enamelled copper wire D = 3 mm;
d = 1 mm;
length = 2 mm;
leads = 2 × 6 mm
L2
4 turns enamelled copper wire D = 2 mm;
d = 1 mm;
length = 13 mm;
leads = 2 × 5 mm
L3
stripline
-
(L × W) 96 mm × 3 mm
L4, L5
stripline
-
(L × W) 15 mm × 8 mm
L6
stripline
-
(L × W) 105 mm × 6 mm
L7
stripline
-
(L × W) 3 mm × 6 mm
L8
stripline
-
(L × W) 12 mm × 6 mm
R1
metal film resistor
100 Ω; 0.6 W
[1] American Technical Ceramics type 100B or capacitor of same quality.
input
50 Ω C1
L3
C2
VGG
C9
C8
VDD
C19
B1
C20
R1
C3
C7
L1
C13 C14
L4
L5
L6
C4
C5 C6
C10
C11 C12
Fig 9. Class-AB common-source production test circuit
L7
L2
L8
output
C18 50 Ω
C16
C17
C15
001aaj148
BLF573_BLF573S
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 8 July 2010
© NXP B.V. 2010. All rights reserved.
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