BLF573 Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание

производитель

BLF573

HF / VHF power LDMOS transistor

NXP Semiconductors. 

NXP Semiconductors

9. Package outline

Flanged LDMOST ceramic package; 2 mounting holes; 2 leads

BLF573; BLF573S

HF / VHF power LDMOS transistor

SOT502A

D

A

F

3

D1

U1

B

q

C

c

1

L

H U2

A

2

b

p

E1

E

w1 M A M B M

w2 M C M

Q

0

5 10 mm

scale

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

UNIT A

b

c

D D1

E

E1

F

H

L

p

Q

q

U1 U2 w1 w2

mm

4.72 12.83 0.15 20.02 19.96 9.50

3.43 12.57 0.08 19.61 19.66 9.30

9.53

9.25

1.14 19.94 5.33

0.89 18.92 4.32

3.38

3.12

1.70

1.45

27.94 34.16

33.91

9.91

9.65

0.25

0.51

inches

0.186

0.135

0.505 0.006

0.495 0.003

0.788 0.786

0.772 0.774

0.374 0.375

0.366 0.364

0.045 0.785

0.035 0.745

0.210 0.133

0.170 0.123

0.067

0.057

1.100

1.345

1.335

0.390

0.380

0.01

0.02

OUTLINE

VERSION

IEC

SOT502A

REFERENCES

JEDEC

JEITA

Fig 11. Package outline SOT502A

BLF573_BLF573S

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 8 July 2010

EUROPEAN

PROJECTION

ISSUE DATE

99-12-28

03-01-10

© NXP B.V. 2010. All rights reserved.

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