ADT7476
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Positive Supply Voltage (VCC)
Maximum Voltage on +12VIN Pin
Maximum Voltage on +5VIN Pin
Maximum Voltage on All Open-Drain Outputs
Voltage on Any Input or Output Pin
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (TJ MAX)
Storage Temperature Range
3.6 V
16 V
6.25V
3.6 V
−0.3 V to +4.2 V
±5 mA
±20 mA
150°C
−65°C to
+150°C
Lead Temperature, Soldering
IR Reflow Peak Temperature
Pb-Free Peak Temperature
Lead Temperature (Soldering, 10 sec)
ESD rating
220°C
260°C
300°C
1500 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
24-Lead QSOP
122
θJC
31.25
Unit
°C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 6 of 72