ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Electrical
AVDD1
AVDD2
DRVDD
GND
AVDD2
AVDD2
AVDD1
Digital Outputs
(DOUTx+, DOUTx−,
DCO+, DCO−,
FCO+, FCO−)
CLK+, CLK−, GAIN+,
GAIN−
LI-x, LO-x, LOSW-x
CWDx−, CWDx+
PDWN, STBY, SCLK, CSB
RBIAS, VREF, SDIO
Environmental
Operating Temperature
Range (Ambient)
Storage Temperature
Range (Ambient)
Maximum Junction
Temperature
Lead Temperature
(Soldering, 10 sec)
With
Respect To Rating
GND
GND
GND
GND
AVDD1
DRVDD
DRVDD
GND
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +3.9 V
−2.0 V to +3.9 V
−2.0 V to +2.0 V
−0.3 V to +2.0 V
GND
LG-x
GND
GND
GND
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
AD9273
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Airflow Velocity (m/sec)
0.0
1.0
2.5
θJA1
θJB θJC Unit
20.3 N/A N/A °C/W
14.4 7.6 4.7 °C/W
12.9 N/A N/A °C/W
1 θJA is for a 4-layer PCB with a solid ground plane (simulated). The exposed
pad is soldered to the PCB.
ESD CAUTION
Rev. B | Page 11 of 48