AD8324ACPZ(RevC) Просмотр технического описания (PDF) - Analog Devices
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AD8324ACPZ Datasheet PDF : 16 Pages
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AD8324
Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.50
BSC
0.30
0.25
0.18
16
15
20
1
EXPOSED
PAD
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
11
5
0.65
0.60
10
6
BOTTOM VIEW
0.20 MIN
0.55
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1.
Figure 27. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body, and 0.75 mm Package Height
(CP-20-6)
Dimensions shown in millimeters
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
0.065 (1.65)
0.049 (1.25)
0.010 (0.25)
0.004 (0.10)
COPLANARITY
0.004 (0.10)
20
11
0.158 (4.01)
0.154 (3.91)
0.150 (3.81) 0.244 (6.20)
1
10
0.236 (5.99)
0.228 (5.79)
0.025 (0.64)
BSC
0.012 (0.30)
0.008 (0.20)
0.069 (1.75)
0.053 (1.35)
SEATING
PLANE
0.010 (0.25)
0.006 (0.15)
0.020 (0.51)
0.010 (0.25)
8°
0°
0.050 (1.27)
0.041 (1.04)
REF
0.016 (0.41)
COMPLIANT TO JEDEC STANDARDS MO-137-AD
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 28. 20-Lead Shrink Small Outline Package [QSOP]
(RQ-20)
Dimensions shown in inches and (millimeters)
ORDERING GUIDE
Model1
AD8324ACPZ
AD8324ACPZ-REEL7
AD8324JRQZ-REEL7
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−25°C to +70°C
Package Description
20-Lead Lead Frame Chip Scale Package [LFCSP]
20-Lead Lead Frame Chip Scale Package [LFCSP]
20-Lead Shrink Small Outline Package [QSOP]
Package Option
CP-20-6
CP-20-6
RQ-20
©2003–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04339-0-5/16(C)
Rev. C | Page 16 of 16
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