Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.50
BSC
0.30
0.25
0.20
19
18
24
1
EXPOSED
PAD
PIN 1
INDICATOR
2.20
2.10 SQ
2.00
0.50
0.40
13
12
6
7
BOTTOM VIEW
0.25 MIN
0.30
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE CONNECTION DIAGRAM
SECTION OF THIS DATA SHEET
COPLANARITY
0.08
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8.
Figure 41. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-24-10)
Dimensions shown in millimeters
AD8003
ORDERING GUIDE
Model1
AD8003ACPZ-R2
AD8003ACPZ-REEL7
AD8003ACHIPS
AD8003ACPZ-EBZ
1 Z = RoHS Compliant Part.
Temperature Range
–40°C to +85°C
–40°C to +85°C
Package Description
24-Lead LFCSP_WQ
24-Lead LFCSP_WQ
Die
Evaluation Board
Package Option
CP-24-10
CP-24-10
Ordering Quantity
250
1,500
Rev. C | Page 15 of 16