AD7879 Просмотр технического описания (PDF) - Analog Devices
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Компоненты Описание
производитель
AD7879 Datasheet PDF : 40 Pages
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Data Sheet
OUTLINE DIMENSIONS
1.670
1.610
1.550
BOTTOM VIEW
(BALL SIDE UP)
32 1
BALL A1
IDENTIFIER
0.650
0.590
0.530
SEATING
PLANE
2.070
2.010
1.950
1.50
REF
TOP VIEW
(BALL SIDE DOWN)
END VIEW
0.50
BSC
0.17
0.370
0.350
0.15
0.13
0.330
COPLANARITY
0.10
A
B
C
D
1.00
REF
0.360
0.320
0.280
0.280
0.240
0.220
Figure 47. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-1)
Dimensions shown in millimeters
1.555
1.505
1.455
BOTTOM VIEW
(BALL SIDE UP)
32 1
BALL A1
IDENTIFIER
A
2.055
2.005
1.50
REF
B
1.955
C
D
0.50
BSC
0.650
0.595
0.540
TOP VIEW
(BALL SIDE DOWN)
END VIEW
1.00
REF
0.380
0.355
0.330
COPLANARITY
0.10
SEATING
PLANE
0.340
0.320
0.300
0.270
0.240
0.210
Figure 48. 12-Ball, Backside-Coated Wafer Level Chip Scale Package [WLCSP]
(CB-12-5)
Dimensions shown in millimeters
AD7879/AD7889
Rev. D | Page 39 of 40
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