Data Sheet
AD5628/AD5648/AD5668
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.65
BSC
0.45
0.40
0.35
0.35
0.30
0.25
13
16
12
1
EXPOSED
PAD
4
9
8
5
BOTTOM VIEW
PIN 1
INDICATOR
2.70
2.60 SQ
2.50
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 64. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-17)
Dimensions shown in millimeters
BALL A1
IDENTIFIER
0.650
0.595
0.540
SEATING
PLANE
2.645
2.605 SQ
2.565
TOP VIEW
(BALL SIDE DOWN)
1.50
REF
0.50
REF
4321
A
B
C
D
BOTTOM VIEW
(BALL SIDE UP)
SIDE VIEW
0.340
0.320
0.300
COPLANARITY
0.05
0.270
0.240
0.210
Figure 65. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-16)
Dimensions shown in millimeters
Rev. J | Page 29 of 30