AD5545/AD5555
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
1
8
PIN 1
1.20
MAX
0.15
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19
COPLANARITY
SEATING
PLANE
0°
0.45
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB
Figure 25. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16)—Dimensions shown in millimeters
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
ORDERING GUIDE
AD5545/AD5555 Products
Temperature
INL LSB DNL LSB RES (Bits) Range
AD5545BRU*
±2
±1
16
–40°C to +85°C
AD5545BRU–REEL7
±2
±1
16
–40°C to +85°C
AD5555CRU
±1
±1
14
–40°C to +85°C
AD5555CRU–REEL7
±1
±1
14
–40°C to +85°C
*The AD5545/AD5555 contain 3131 transistors. The die size measures 71 mil. × 96 mil., 6816 sq. mil.
Package
Description
TSSOP-16
TSSOP-16
TSSOP-16
TSSOP-16
Package
Outline
RU–16
RU–16
RU–16
RU–16
Qty
96
1000
96
1000
© 2003 Analog Devices, Inc. All rights reserved. Trademarks and regis-
tered trademarks are the property of their respective companies.
C02918-0-7/03(0)
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