2N7002-215 Просмотр технического описания (PDF) - NXP Semiconductors.
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2N7002-215 Datasheet PDF : 13 Pages
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NXP Semiconductors
8. Package outline
Plastic surface-mounted package; 3 leads
2N7002
60 V, 300 mA N-channel Trench MOSFET
SOT23
D
B
E
A
X
3
1
e1
bp
e
2
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45 0.55
0.15 0.45
0.2
0.1
OUTLINE
VERSION
SOT23
REFERENCES
IEC
JEDEC
JEITA
TO-236AB
Fig 13. Package outline SOT23 (TO-236AB)
2N7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
© NXP B.V. 2011. All rights reserved.
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