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AD8318(2006) Просмотр технического описания (PDF) - Analog Devices

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AD8318 Datasheet PDF : 24 Pages
First Prev 21 22 23 24
AD8318
OUTLINE DIMENSIONS
4.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.30
0.80
0.23
SEATING
PLANE
0.18
0.60 MAX
3.75
BSC SQ
0.65 BSC
0.75
0.60
0.50
0.60 MAX
PIN 1
INDICATOR
13
16
12
1
EXPOSED
PAD
(BOTTOM VIEW)
9
4
8
5
2.25
2.10 SQ
1.95
0.25 MIN
1.95 BSC
0.05 MAX
0.02 NOM
0.20 REF COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
Figure 50. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
AD8318ACPZ-REEL71 −40°C to +85°C
AD8318ACPZ-WP1, 2 −40°C to +85°C
AD8318-EVAL
Package Description
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Package Option
CP-16-4
CP-16-4
Ordering Quantity
1500
64
1 Z = Pb-free part.
2 WP = waffle pack.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04853-0-1/06(A)
Rev. A | Page 24 of 24

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