VNQ810M(2013) Просмотр технического описания (PDF) - STMicroelectronics

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Компоненты Описание

производитель

VNQ810M
(Rev.:2013)

Quad channel high side driver

STMicroelectronics 

VNQ810M

Package and packing information

5

Package and packing information

5.1

ECOPACK® packages

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second-level interconnect. The category of

Second-Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 31. SO-28 package dimensions

t(s) - Obsolete Product(s) Table 16. SO-28 mechanical data

duc Symbol

ro Min.

PA

te a1

0.10

le b

0.35

so b1

0.23

Ob C

Millimeters

Typ.

0.50

Max.

2.65

0.30

0.49

0.32

c1

45° (typ.)

D

17.7

18.1

E

10.00

10.65

e

1.27

e3

16.51

F

7.40

7.60

L

0.40

1.27

S

8° (max.)

25/28

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