UPC29M00HB Просмотр технического описания (PDF) - NEC => Renesas Technology

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Компоненты Описание

производитель

UPC29M00HB

THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR

NEC => Renesas Technology 

µPC29M00 Series

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our

sales offices.

Fof more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Surface mount devices

µPC29M00T Series: MP-3Z

Process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Conditions

Peak temperature: 235 °C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210 °C or higher),

Maximum number of reflow processes: 2 times.

Peak temperature: 215 °C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200 °C or higher),

Maximum number of reflow processes: 2 times.

Solder temperature: 260 °C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120 °C or below (Package surface temperature).

Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR35-00-2

VP15-00-2

WS60-00-1

—

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or

the device will be damaged by heat stress.

Through-hole devices

µPC29M00HF Series: MP-45G

µPC29M00HB Series: MP-3

Process

Wave soldering

(only to leads)

Partial heating method

Conditions

Solder temperature: 260 °C or below,

Flow time: 10 seconds or less.

Pin temperature: 300 °C or below,

Heat time: 3 seconds or less (Per each pin).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make

sure that the package body does not get jet soldered.

17

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