SMBG5338B Просмотр технического описания (PDF) - Micro Commercial Components
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SMBG5338B Datasheet PDF : 4 Pages
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MCC
omponents
21201 Itasca Street Chatsworth
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Features
• Low profile package for surface mounting (flat handling
surface for accurate placement)
• Zener Voltage 3.3V to 200V
• High Surge Current Capability
• For available tolerances – see note 1
• Available on Tape and Reel (see EIA std RS-481)
Mechanical Data
• Standard JEDEC outlines as shown
• Terminals gull-wing or c-bend (modified J-bend) tin-lead plated
and solderable per MIL-STD-750, method 2026
• Polarity is indicated by cathode band
• Maximum temperature for soldering: 260oC for 10 seconds.
Maximum Ratings @ 25 oC Unless Otherwise Specified
Forward Voltage at 1.0A
VF
1.2 Volts
Current
Steady State Power
Dissipation
Operating and Storage
Temperatures
Thermal Resistance
P(AV)
TJ, TSTG
RθJL
5 Watts
See note 2
-55oC to
+ 150oC
25oC/W
Notes
1. Mounted on copper pads as shown below.
2. Lead temperature at 25oC = TL at mounting plane. Derate
linearly above 25oC to zero power at 150 oC
PAD LAYOUT
Modified J Bend
0.090"
0.085”
0.070”
SMBJ5333B
THRU
SMBJ5388B
5 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMBJ) (Round Lead)
H
Cathode Band
J
A
C
E
D
F
G
INCHES
DIM
MIN
A
.078
B
.075
C
.002
D
-----
E
.035
F
.065
G
.205
H
.160
J
.130
DIMENSIONS
MAX
.116
.089
.008
.02
.055
.091
.224
.180
.155
MM
MIN
1.98
1.90
.05
-----
.90
1.65
5.21
4.06
3.30
B
MAX
2.95
2.25
.20
.51
1.40
2.32
5.69
4.57
3.94
NOTE
www.mccsemi.com
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