MT47H256M4HW-3ITH Просмотр технического описания (PDF) - Micron Technology

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MT47H256M4HW-3ITH

1Gb: x4, x8, x16 DDR2 SDRAM

Micron Technology 

1Gb: x4, x8, x16 DDR2 SDRAM

Electrical Specifications – Absolute Ratings

Table 6: Temperature Limits

Parameter

Symbol

Min

Max

Units

Notes

Storage temperature

Operating temperature: commercial

Operating temperature: industrial

Operating temperature: automotive

TSTG

–55

150

°C

1

TC

0

85

°C

2, 3

TC

–40

95

°C

2, 3, 4

TA

–40

85

°C

4, 5

TC

–40

105

°C

2, 3, 4

TA

–40

105

°C

4, 5

Notes:

1. MAX storage case temperature TSTG is measured in the center of the package, as shown

in Figure 12. This case temperature limit is allowed to be exceeded briefly during pack-

age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering Pa-

rameters.”

2. MAX operating case temperature TC is measured in the center of the package, as shown

in Figure 12.

3. Device functionality is not guaranteed if the device exceeds maximum TC during opera-

tion.

4. Both temperature specifications must be satisfied.

5. Operating ambient temperature surrounding the package.

Figure 12: Example Temperature Test Point Location

Test point

Length (L)

0.5 (L)

0.5 (W)

Width (W)

Lmm x Wmm FBGA

PDF: 09005aef8565148a

1GbDDR2.pdf – Rev. AA 07/14 EN

24

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2007 Micron Technology, Inc. All rights reserved.

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